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CYW20829
  • CYW20829

CYW20829

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The AIROC™ CYW20829 Bluetooth® LE MCU with its included peripheral support enables evaluation, prototyping, and development of a wide array of Bluetooth® Low Energy applications, all on Infineon’s low power, high performance AIROC™ CYW20829. The AIROC™ CYW20829’s robust RF performance and 10 dBm TX output power without an external power amplifier (PA).

Infineon Technologies CYW20829 Product Info

16 April 2026 0

Parameters

Bluetooth Classic

No

Bluetooth LE RX SENSITIVITY

-98 dBm (LE1M)

Bluetooth LE TX POWER

10 dbm

Bluetooth LE

Yes

Bluetooth Subsystem

48 MHz ARM Cortex M33 supporting PAwR, LE Long Range, ISOC Channels, Advertisement Extensions

Cache

32 kByte

CPU Frequency

96 MHz

CPU

Arm® Cortex®-M33

Family

AIROC™ Bluetooth LE

GPIOs

32

Launch Date

31-03-2024

Longevity - 15 years

Yes

Longevity - Extended

No

MCU Subsystem

ARM Cortex M33 configurable with 96/48 MHz

Operating Temperature range

-40 °C to 85 °C

Partner Module

N

Peripherals

CAN-FD, LIN, 11-bit ADC (Sigma Delta), Keyscan, DMA, RTC, I2C, UART, PDM, 9 timers

Planned to be available until at least

31-03-2039

RAM

256 kByte

ROM

64 kByte

Security

Secure-boot, True Random Number Generator (TRNG), cryptographic hardware acceleration, encrypted image support for external flash

Sensitivity (best) (dBm)

-106 (LE Coded PHY)

Supported Protocols

Bluetooth Low Energy 5.4

Type

Wireless MCU

Apps

Automotive BMS, Remote control, Healthcare, Industrial automation, LED lighting system design, Smart home and building, Electronic shelf label (ESL), PC accessories

Features

  • Highly integrated Bluetooth® LE 5.4 MCU
  • 96 MHz ARM Cortex M33 – Application MCU
  • 48 MHz ARM Cortex M33 – Bluetooth® Subsystem
  • 256 KB / 96 KB SRAM – Bluetooth® LE
  • 48 MHz QSPI/SMIF with XIP, 32 KB Cache
  • On-the-fly encryption for off-chip Flash
  • Secure Boot & Crypto HW engine
  • TX Power: up to +10 dBm
  • Robust Receive sensitivity of -106 dBm
  • 1.7 to 3.6 V supply voltage range
  • 32 Programmable GPIO
  • Upto 85°C operating temperature

Description

  • Industry’s best range and noise immunity
  • Future proof your designs and unlock new use cases with Bluetooth LE 5.4
  • Reduce system cost with highly integrated MCU and “right sized” external flash
  • Longer battery life with low power connection
  • No dongle for ultra low latency HID

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