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CYW20819
  • CYW20819

CYW20819

The AIROC™ CYW20819 Bluetooth® & Bluetooth® LE SoC is a Bluetooth® 5.4 Core compliant device for IoT applications. Manufactured using the industry's advanced 40 nm CMOS low-power process, the CYW20819 employs high levels of integration to minimize external components, reducing the device footprint and the costs associated with implementing Bluetooth® solutions.

Infineon Technologies CYW20819 Product Info

16 April 2026 0

Parameters

Bluetooth Classic

Yes

Bluetooth EDR 2MBPS RX SENSITIVITY

-94.5 dBm

Bluetooth LE RX SENSITIVITY

-95 dBm

Bluetooth LE TX POWER

4.5 dBm

Bluetooth LE

Yes

Bluetooth Specification

5.4

CPU Frequency

96 MHz

CPU

Arm® Cortex®- M4

Family

AIROC™ Bluetooth LE & Bluetooth

Flash

256 kByte

GPIOs

22

Launch Date

31-03-2018

Longevity - 15 years

Yes

Longevity - Extended

No

Operating Temperature range

-30 °C to 85 °C

Operating Voltage range

1.71 V to 3.3 V

Partner Module

N

Planned to be available until at least

31-03-2033

RAM

176 kByte

ROM

1024 kByte

Software Support

ModusToolbox™

Apps

Data center power solutions, Semiconductor solutions for home entertainment applications, Smart speaker designs, Refrigerators and freezers, Domestic robots

Features

  • Onboard crystal oscillator
  • Passive components
  • Flash memory
  • Arm® Cortex®-M4 core
  • Bluetooth® stack in ROM
  • 256-KB on-chip flash
  • 176-KB on-chip RAM
  • True Random Number Generator (TRNG)
  • AES-128
  • ECDSA signature verification
  • Security functions in ROM
  • Over-the-air (OTA) firmware updates

Description

  • Support fast time-to-market
  • Support a wide spectrum of applications
  • Low power
  • Low cost

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