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CY62177G30-55ZXI
  • CY62177G30-55ZXI

CY62177G30-55ZXI

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Infineon's 32Mb density Ultra-Low-Power (ULP) SRAM with on-chip ECC offers high-performance and reliability for mission-critical industrial systems. With an industry-leading standby current of 19µA at +85°C, it ensures best-in-class battery lifetimes. This high-capacity parallel interface asynchronous SRAM, based on 65-nm technology, features embedded ECC and bit-interleaving, providing freedom from soft errors with < 0.1 FITs/Mbit.

Infineon Technologies CY62177G30-55ZXI Product Info

16 April 2026 0

Parameters

Density

32 MBit

Family

MoBL™ SRAM

Interfaces

Parallel

Lead Ball Finish

Pure Sn

Operating Temperature range

-40 °C to 85 °C

Operating Voltage range

2.2 V to 3.6 V

Organization (X x Y)

2M x 16

Peak Reflow Temp

260 °C

Planned to be available until at least

2033

Qualification

Industrial

Features

  • 32Mbit SRAM, 2Mx16
  • High-speed parallel bus
  • 55ns access time
  • Operating voltage: 2.2-3.6V
  • Ultra-low-power standby
  • Embedded ECC
  • 1.5V data retention
  • RoHS-compliant 48-pin TSOP (I)

Description

  • Low-power battery-backed datalogging
  • Freedom from soft errors
  • Compatible with lower density SRAMs
  • Drop-in legacy SRAM compatibility

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