0
OUTLINE
  • Preface

  • Extended Temperature Operation

  • Core Features and Performance Parameters

  • Time-Sensitive Networking and Clock Synchronization

  • Interface Flexibility

  • System-Level Diagnostics and Power Management

  • Application Domains

  • Conclusion

DP83867ERGZR: Extended-Temperature, Low-Latency Gigabit Ethernet PHY with SGMII and TSN Support

14 October 2026     By Ryan 2

Preface

 

The DP83867ERGZR is a robust, low-power, fully featured Ethernet physical layer transceiver from Texas Instruments, distinguished by its extended operating temperature range of –40°C to +105°C. Housed in a compact 48-pin VQFN package measuring 7 mm × 7 mm, this device integrates the PMD sublayers necessary to support 10BASE-Te, 100BASE-TX, and 1000BASE-T Ethernet protocols over standard twisted-pair cabling. It is engineered for applications where determinism, thermal resilience, and interface flexibility converge—particularly industrial networking equipment, ruggedized embedded systems, and time-sensitive communication infrastructure.

 

Extended Temperature Operation

 

The DP83867ERGZR's 105°C maximum ambient temperature rating sets it apart from the commercial (0°C to +70°C) and industrial (–40°C to +85°C) variants within the DP83867 family. This extended range enables deployment in environments where heat generation from adjacent components, enclosed cabinets without active cooling, or high-ambient industrial settings would otherwise rule out standard PHYs. Applications in motor drives, power conversion equipment, and outdoor networking enclosures can benefit from the additional thermal headroom.

 

Core Features and Performance Parameters

 

Parameter

DP83867ERGZR

Operating Temperature

–40°C to +105°C

Package

VQFN (RGZ), 48-pin, 7 mm × 7 mm

Copper Protocols

10BASE-Te, 100BASE-TX, 1000BASE-T

MAC Interfaces

RGMII, SGMII

Latency (TX)

< 90 ns

Latency (RX)

< 290 ns

Power Consumption

457 mW (full operation)

ESD Protection

> 8000 V IEC 61000-4-2 (direct contact)

Emissions

Meets EN55011 Class B

I/O Voltage

Configurable: 3.3 V, 2.5 V, 1.8 V

RGMII Delay Modes

16 programmable on RX/TX

Clock Output

25 MHz or 125 MHz synchronized

 

The device consumes only 457 mW under full operating power, a figure that reflects careful design for energy-sensitive systems. The ESD protection exceeds 8000 V on the IEC 61000-4-2 direct-contact standard, providing robust immunity against electrostatic discharge events that are common in industrial environments where cables are frequently connected and disconnected.

 

Time-Sensitive Networking and Clock Synchronization

 

The DP83867ERGZR is Time-Sensitive Network (TSN) compliant, supporting the IEEE 802.1 standards that bring deterministic latency and bounded jitter to standard Ethernet. The physical layer's contribution to TSN is substantial: the sub-90 ns transmit latency and sub-290 ns receive latency minimize the baseline delay through the PHY, directly improving the end-to-end latency budget of the network.

 

IEEE 1588 time stamping is supported through Start of Frame Detect (SFD) functionality. The SFD output signals the precise moment of packet arrival, allowing an external IEEE 1588 clock or the MAC to capture a hardware-level timestamp that is immune to interrupt latency and software scheduling jitter. A 25 MHz or 125 MHz synchronized clock output is provided for Synchronous Ethernet applications, and the recovered clock output supports frequency synchronization across network nodes.

 

Interface Flexibility

 

The device connects to the MAC layer through either Reduced GMII (RGMII) or embedded-clock Serial GMII (SGMII). The RGMII path uses double-data-rate signaling for a compact pin count, while the SGMII path serializes the data onto a single differential pair in each direction, embedding the clock within the data stream. The 16 programmable RGMII delay modes on both receive and transmit paths give the designer fine-grained control over timing relationships, compensating for PCB trace length variations and MAC input setup/hold requirements without external delay lines.

 

Configurable I/O voltage options—3.3 V, 2.5 V, and 1.8 V—allow the PHY to match the host MAC's I/O levels directly, eliminating level shifters. Integrated MDI termination resistors and programmable MAC interface termination impedance reduce the external component count and simplify board layout.

 

System-Level Diagnostics and Power Management

 

Cable diagnostics are integrated into the device, enabling detection and characterization of cable faults such as opens, shorts, and impedance mismatches. RJ45 mirror mode provides port mirroring at the PHY level for network monitoring without consuming switch fabric resources. Wake-on-LAN (WoL) packet detection allows the system to enter a low-power state while the PHY monitors the network for a magic packet that triggers a wake-up event. The fast link drop mode accelerates link-down detection, which is beneficial in redundant network configurations. JTAG support is provided for boundary scan testing.

 

Application Domains

 

The DP83867ERGZR is positioned for industrial networking equipment that must operate reliably in elevated ambient temperatures. Programmable logic controllers, industrial Ethernet switches, motion controllers, and motor drives all represent natural applications where the 105°C rating provides necessary thermal margin. The TSN compliance and low latency support the deterministic communication required for real-time control loops in factory automation.

 

In telecom and infrastructure equipment, the Synchronous Ethernet clock output and IEEE 1588 time stamping enable the frequency and phase synchronization required for cellular backhaul and industrial IoT gateways. Test and measurement instruments that require precise timestamping of network events can also leverage the SFD-based IEEE 1588 support. The extended temperature range makes the device suitable for outdoor enclosures and equipment installed in unconditioned spaces.

 

Conclusion

 

The DP83867ERGZR combines extended-temperature operation, ultra-low latency, and TSN compliance in a single compact PHY. Its ability to operate reliably at 105°C, coupled with sub-90 ns transmit latency and hardware-assisted IEEE 1588 timestamping, addresses the physical-layer requirements of industrial networks where both thermal resilience and determinism are non-negotiable. For designers working at the intersection of harsh-environment operation and time-critical communication, this device provides a well-integrated foundation.

 


About Ryan

Ryan is an Electronic Engineer at Welllinkchips with 12+ years of industry experience. He writes clear, practical resources that help engineering and procurement teams evaluate component specifications, circuit performance, reliability, lifecycle risk, and supplier considerations.

His work is intended to support informed design and purchasing decisions for active, obsolete, and hard-to-source electronic components.

Areas of focus

· Electronic circuit design and component selection

· Obsolete and end-of-life component risk

· Supplier verification and counterfeit-risk reduction

· Component alternatives and BOM continuity

Subscribe to Welllinkchips !
Your Name
* Email
Submit a request