Analog Devices MAX4693 Product Info

• 16 Bump, 0.5mm-Pitch UCSP (2mm x 2mm)
• 1.8V Logic Compatibility
• Guaranteed On-Resistance
  • 70Ω (max) with +2.7V Supply
  • 35Ω (max) with +5V Supply
  • 25Ω (max) with ±4.5V Dual Supplies
• Guaranteed Match Between Channels
  • 5Ω (max) with +2.7V Supply
  • 3Ω (max) with ±4.5V Dual Supplies
• Guaranteed Flatness Over Signal Range
  • 3.5Ω (max) with ±4.5V Dual Supplies
• Low Leakage Currents Over Temperature
  • 20nA (max) at +85°C
• Fast 90ns Transition Time
• Guaranteed Break-Before-Make
• Single-Supply Operation from +2V to +11V
• Dual-Supply Operation from ±2V to ±5.5V (MAX4691/MAX4692/MAX4693)
• V+ to V- Signal Handling
• Low Crosstalk: -90dB (100kHz)
• High Off-Isolation: -88dB (100kHz)

The MAX4691–MAX4694 are low-voltage CMOS analog ICs configured as an 8-channel multiplexer (MAX4691), two 4-channel multiplexers (MAX4692), three single-pole/double-throw (SPDT) switches (MAX4693), and four SPDT switches (MAX4694).

The MAX4691/MAX4692/MAX4693 operate from either a single +2V to +11V power supply or dual ±2V to ±5.5V power supplies. When operating from ±5V supplies they offer 25Ω on-resistance (R_ON), 3.5Ω (max) R_ON flatness, and 3Ω (max) matching between channels. The MAX4694 operates from a single +2V to +11V supply. Each switch has rail-to-rail signal handling and a low 1nA leakage current.

All digital inputs are 1.8V logic-compatible when operating from a +3V supply and TTL compatible when operating from a +5V supply.

The MAX4691–MAX4694 are available in 16-pin, 4mm x 4mm QFN and TQFN and 16-bump UCSP packages. The chip-scale package (UCSP™) occupies a 2mm x 2mm area, significantly reducing the required PC board area.

Applications

• Audio/Video Signal Routing
• Battery-Operated Equipment
• Cell Phones
• Communications Circuits
• Modems