ADMV1228

RECOMMENDED FOR NEW DESIGNS

24.0 GHz to 29.5 GHz 2 Transmit/2 Receive Dual Polarization UDC + Beamformer

Analog Devices ADMV1228 Product Info

10 February 2026 5

Features

Integrated 16 (2x8) channel beamformer paired with a 2 transmit (TX) and 2 receive (RX) channel upconverter/downconverter (UDC)
RF range: 24.0 GHz to 29.5 GHz
x2 / x4 LO multiplier option
Optional external filtering for spurious rejection
Significant power consumption reduction per beamformer channel vs. previous generations
16 configurable TX and RX channels
Dual polarization, 8 horizontal and 8 vertical channels paired to independent UDCs
Matched to 50 Ω, single-ended RF inputs/outputs and single-ended LO input
Fast TDD switching using TRX_x pins

On-chip temperature sensor for RX and TX automatic temperature compensation for Gain
Memory for TX and RX beam positions
NVM for phase and gain calibration
Upconversion mode
- Sideband rejection and carrier feedthrough optimization
- Envelope detector for LO feedthrough calibration
- Single channel power detector
Downconversion mode
- Integrated individual RX channel overload detection circuits
3-wire or 4-wire SPI that supports up to 133 MHz SPI clock speed

Part details & applications

The ADMV1228 is a 24.0 GHz to 29.5 GHz, mmW 5G dual channel upconverter, dual channel downconverter and beamformer integrated on a single chip. The RF integrated circuit (RFIC) combines two transmit/receive streams (2T2R) with 16 independent TX and RX beamformer channels in a 2 by 8 configuration supporting both single and dual polarization array designs.

The on-chip transmit receive switches connect the upconverter RF output and downconverter RF input for each polarization into eight independent channels via the 1:8 power splitters/combiners.

The ADMV1228 comes in a compact, chip scale ball grid array package. The ADMV1228 operates over the −40°C to +95°C case temperature (T_C) range. This package allows heatsinking the ADMV1228 from the topside of the package for the most efficient thermal heatsinking and to allow flexible antenna placement on the opposite side of the printed circuit board (PCB).

Applications

mmW 5G application
Broadband communication

Subscribe to Welllinkchips !

Your Name

* Email