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MAX22701EASA+T Analog Devices Inc. Isolators - Gate Drivers image
  • MAX22701EASA+T Analog Devices Inc. Isolators - Gate Drivers image
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Analog Devices Inc. MAX22701EASA+T

Manufacturer
Analog Devices Inc.
Mfr. Part #
MAX22701EASA+T
WLX Part #
A22507364398
Package
8-SOIC (0.154", 3.90mm Width)
Datasheet
MAX22701EASA+T Datasheet (PDF)
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MAX22701EASA+T Parameter Description

The MAX22700–MAX22702 are a family of single-channel isolated gate drivers with ultra-high common-mode transient immunity (CMTI) of 300kV/µs (typ). TThe devices are designed to drive silicon-carbide (SiC) or gallium-nitride (GaN) transistors in various inverter or motor control applications with different output gate-drive circuitry and B-side supply voltages. The devices feature variants with output options for gate driver common pin GNDB (MAX22700), Miller Clamp (MAX22701), and adjustable undervoltagelockout UVLO (MAX22702). In addition, variants are offered as differential (D versions) or single-ended (E versions) inputs. All devices have integrated digital galvanic isolation using Maxim’s proprietary process technology. The MAX22700–MAX22702 feature isolation for a withstand voltage rating of 3kVRMS (narrow SOIC package) or 5kVRMS (wide SOIC package) for 60 seconds.

All devices support a minimum pulse width of 20ns with a maximum pulse width distortion of 2ns. The part-to-part propagation delay is matched within 2ns (max) at +25°C ambient temperature, and 5ns (max) over the -40°C to +125°C operating temperature range. This feature reduces the power transistor’s dead time, thus improving overall efficiency.

The MAX22700 and the MAX22702 have a maximum RDSON of 1.25Ω for the low-side driver, and the MAX22701 has an RDSON of 2.5Ω for the low-side driver. All devices have a maximum RDSON of 4.5Ω for the high-side driver. See the Ordering Information for suffixes associated with each option.

The MAX22700–MAX22702 are available either in an 8-pin wide-body SOIC package with 8mm creepage and clearance, or in a smaller 8-pin narrow-body SOIC package with 4mm of creepage and


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The following are some common countries' logistic time.



Note: 

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Quality testing (QC process according to international standards to guarantee product quality)
Testing process:
Primary testing
Labels and outer packaging
Secondary testing
Appearance and electrical properties
Tertiary testing
Slicing, open cap, solderability, ambient temperature, ageing, X-RAY, ultrasound

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  • Electrical performance testing

  • Key functional testing

  • Key functional testing

  • Slice testing

  • X-RAY Inspection

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